Hybrid Low-Thermal-Expansion Photocurable Nanocomposite Resin for Metallization-Compatible Additive Manufacturing

Description:

This innovative resin formulation combines bisphenol A epoxy diacrylate oligomer, trimethylolpropane triacrylate, phosphine oxide photoinitiators, nanosilica, silane-functionalized hexagonal boron nitride, multi-walled carbon nanotubes, and graphene nanoplatelets to create a low thermal expansion material with shear-thinning rheology and high thermal stability. Designed to address thermal mismatch issues between SLA photopolymers and metal coatings, it improves interfacial adhesion and reduces cracking and delamination in metallized additive manufacturing parts.

Key Advantages:

• Significantly reduced coefficient of thermal expansion (~103 µm·m⁻¹·°C⁻¹) to enhance thermal compatibility with metallic coatings.
• Maintains SLA printability due to optimized shear-thinning rheology.
• Exhibits thermal stability above 400°C, suitable for demanding applications.
• Tunable electrical resistivity for multifunctional applications.
• Integrates multiple functionalities without requiring hardware modifications in additive manufacturing processes.

Problems Solved:

• Eliminates interfacial stresses caused by thermal mismatch between photopolymer resins and metal coatings.
• Prevents cracking and delamination in metallized SLA parts.
• Overcomes typical viscosity and dispersion challenges in nanocomposite resin formulations.

Market Applications:

• Aerospace components requiring metallized additive manufacturing with high thermal stability.
• Electronics industry for conductive and thermally compatible 3D printed parts.
• Specialty coatings combined with additive manufacturing for defense and industrial uses.
• Additive manufacturing resin production companies seeking advanced multifunctional materials.